Last Thursday, Chinese tech giant Huawei launched Mate 30 and its Pro variant. Since the U.S. has banned Huawei from accessing its supply chain, this series does not include any Google services or apps. Today, a semiconductor research organization announced the Huawei Mate 30 supply chain supplier list, covering literally everything starting from the camera to screen, and battery.
We can see that with Huawei Mate 30 smartphone, the proportion of domestic manufacturers has increased and some of them are familiar Chinese domestic brands like BOE, TCL, Huiding Technology and Lixun Precision. The Huawei Mate 30 and Mate 30 Pro supplier announced so far is given below.
Here check out the list of Huawei Mate 30 supplier list,
Huawei Mate 30 Camera –
- CIS: Sony, Weir Howe (8 million telephotos)
- Lens: Sunny Optical, Ou Feiguang, Lianchuang Electronics
- Module: Lixun Precision, Sunny Optical, Ou Feiguang
Huawei Mate 30 Display Screen –
- Panel: BOE, TCL
- Cover glass: Lansi Technology, Berne Optics
- Touch module: Changxin Technology, Ou Feiguang
Huawei Mate 30 Radiofrequency –
- Antenna: Pengding Holdings, Xinwei Communication, Shuobeide
- LNA: Zhuo Shengwei, Weir shares
- PA: Sanan Optoelectronics, Zhuo Shengwei
- Filter: Xinwei Communication, Sanan Optoelectronics, Zhuo Shengwei
Huawei Mate 30 Wireless charging –
- Material: Xinwei Communication, Tony
- Die-cutting: collar puzzle, letter communication
- Module: Lixun Precision, Xinwei Communication
Huawei Mate 30 Fingerprint Scanner –
- Chip: Huiding Technology, Zhaoyi Innovation
- Module: Ou Feiguang, Qiu Ti Technology
Huawei Mate 30 Circuit board –
- PCB: Peng Ding Holdings, Jing Wang Electronics
- FPC: Peng Ding Holdings, Dongshan Precision
- Power Semiconductor: Wentai Technology (Anshi Semiconductor)
Huawei Mate 30 Battery –
- Chip: Xinwangda, ATL
- Module: Desai Battery, Xinwangda Acoustics
- Module: Lixun Precision, Goer Shares, AAC Technologies motor
- Module: Lixun Precision, AAC Technologies
Huawei Mate 30 Chipsets –
- Chip design: Zhaoyi Innovation, Huiding Junzheng
- Chip foundry: SMIC, Hua Hong Hua Li
- Chip package: Changdian Technology, Huatian Technology
- Power Devices: Wentai Technology, Jiejie Microelectronics
- Analog chip: Shengbang shares, Vail shares
- Memory chip: Zhao Yi Innovation, Beijing Junzheng
- FPGA: Ziguang Guowei, Xilinx
- Equipment: North Huachuang, Changchuan Technology
Huawei Mate 30 Bottom support –
- Vail, Huiding, Wentai, Junzheng, Zhaoyi, Ziguang, Zhuosheng, Shengbang, North Huachuang, Zhongwei AMEC
Source: Semiconductor benchmark, author: Wu Wenji, Chen Hang;
Via: IThome
Featured Image: Sky News
