Intel’s processors have seen competition from AMD in the last few months, and the coronavirus pandemic has certainly not helped the tech developer. However, on Architecture Day 2020, Intel announced its first process technology roadmap since 2018 and discussed upcoming chips, graphics, AI tech, and architectural changes.
The highlight of the presentation was the new SoC announcement that will replace Lake Field, the Willow Cove architecture, which will also bring Intel to use Xe integrated graphics instead of the Iris+ graphics range.
Gaming performance using a 15W Xe-LP package matches or exceeds what Intel’s current Gen11 integrated GPU can achieve at 25W power.
Intel’s new Tiger Lake chips are all set to compete against AMD’s Ryzen 4000, and it is said that Tiger Lake will be able to drive more displays at a higher resolution than previous generations of Intel chips.
These chips will use the Willow Cove CPU micro-architecture, a follow-up to Intel’s Sunny Cove. The new version has better security features, a higher cache, and improved clock speeds. The Willow Cove is more efficient than its predecessor, and as a result, the higher speeds do not disrupt or hamper the power consumption numbers.
Another change introduced by the company is that they have decided to drop the “+” suffixes in their product names, they will use the term “10nm SuperFin” for their latest installment in the 10nm process. This is supposed to be Intel’s largest intra-node enhancement ever, and the company has improved the performance and power consumption numbers of the SuperFin without any drop in fabrication size.
Intel looking to come out ahead by the end of 2020
Intel’s chief architect Raja Koduri ran the affairs of their Architecture Day presentation and was instrumental in developing this development path.
Even after the dismissal of Venkata “Murthy” Renduchintala, the high-profile chip engineer who was seen as Intel’s savior, Koduri assured the audience that engineers inside Intel “are more energized, more motivated, more excited about our future than ever.”
PCs built using this combination are expected to go on sale in late 2020, and Tiger Lake CPUs are expected to be announced as early as the first week of September this year.