Some information about Qualcomm’s new SoC, Snapdragon 875, has appeared. It is known that the production has already started.
According to China’s leading IT media, Technical Technology said TSMC has begun manufacturing Snapdragon X60s for Snapdragon 875 and new 5G modems at some plants.
Along with that, it has been found that it will be produced in a 5nm process, and that the Snapdragon X60, a 5G modem, will be integrated into the SoC. Originally, the Snapdragon 865 was “external” because 5G modems “are due to manufacturing challenges and cannot achieve the specs that we expect to integrate.” This change can simplify manufacturing, etc.
We have already found out a certain amount of specs. It is information about one month ago, but you can imagine the performance to some extent.
First of all, it is expected to be equipped with Kyro 685 on the CPU.
It is common for CPUs to be equipped with several cores to achieve both processing performance and high efficiency such as power. The Kyro 685 is expected to consist of a prime core (especially the most powerful but most power-intensive core), one Cortex X1, three Big Cores (high-performance cores), and four Little Core (efficiency-oriented, low-performance cores) in 1+3+4.
The big change from Snapdragon 865 is the prime core. The Snapdragon 865 featured four Cortex-A77 Big Cores, one of which had a role as a prime core by increasing the number of clocks. In other words, the Snapdragon 875 is, in a sense, the first Prime Core SoC in the series.
The cortex X1 also has 30 percent better peak performance and twice the machine learning performance than the previous Cortex A77. At the same time, the Cortex A78 is said to be up to 20% more powerful than the Cortex A77.
In addition, the GPU is said to be equipped with Adreno 660. Specific performance has not been disclosed so far.
The announcement of Snapdragon 875 is expected to take place between October and December of this year. In addition, Xiaomi is expected to be the first to adopt the Snapdragon 875, and we hope to further save power by moving to the 5nm process.