Today, in the morning Chinese tech giant MediaTek Technology Co. Ltd. At its product communication conference revealed the news of a Dimensity 800 series chip to the media. The chip is positioned for the mid-range flagship devices and terminal products. This new chipset will be officially listed in the second quarter of next year and it will be available for sale in the first quarter of next year. However, the company did not disclose any further information or expected specification of the chipset.
Back in 26th November 2019, MediaTek officially released a new 5G new chip brand “Tianyu”, and the company’s integrated 5G SoC Dimensity 1000.
It is reported that the Dimensity 1000 SoC has a number of world firsts. Reports suggest that it is the world’s fastest 5G single chip, the world’s first 5G dual-carrier aggregation support processor, the world’s first 5G dual card dual standby support chip, the world’s first 5G with integrated Wi-Fi 6 SoC chip, and the world’s first flagship 4 core A77 CPU and flagship Mali G77 GPU combo. Apart from this, it reached the highest score at the AnTuTu benchmark.
Dimensity 1000 uses a 7nm process technology and the CPU uses 4 large cores + 4 small core architectures. The A77 cores are clocked at 2.6 GHz while the A55 cores are clocked at 4 2.0 GHz. Compared to the previous generation, performance is increased by 20%. The GPU is a 9 core Mali G77.
Compared to the previous generation Mali G76 GPU, the performance of this upgraded GPU has increased by 40%. The GPU has scored more than 510,000+ at the AnTuTu benchmark. As mentioned above, the Dimensity 800 chipset will be officially launched in Q1 2020.